Mechanical Advanced Packaging Engineer

Mechanical Advanced Packaging Engineer

Description

SAIC is seeking a talented and motivated Advanced Packaging Engineer to support cutting-edge missile system hardware design and analysis efforts. In this role, you will collaborate with multidisciplinary engineering teams to develop, analyze, and validate advanced microelectronics packaging solutions for complex defense systems. This position offers a hybrid work schedule; however, candidates must reside within commuting distance of Crane, IN.

JOB RESPONSIBILITES:

Support mechanical design and analysis of missile system hardware and microelectronics packaging and assembly

Perform mechanical modeling and simulation activities, including finite element analysis (FEA), thermal fatigue, shock and vibration analysis, and MATLAB-based modeling

systems engineering principles throughout all stages of the product lifecycle, including requirement development, verification, and validation

Participate in and support Systems Engineering Technical Reviews, including System Requirements Reviews (SRR), Preliminary Design Reviews (PDR), Critical Design Reviews (CDR), and Production Readiness Reviews (PRR)

Collaborate with design teams to facilitate and document design development activities

Support Technical Interchange Meetings (TIMs) and contribute to cross-functional team discussions

Analyze solder interconnect technologies, including Ball Grid Array (BGA), Column Grid Array (CGA), Flip-Chip, and J-lead packages

Conduct experimental test and evaluation activities, including solder fatigue analysis and material property evaluations

Clearly communicate technical findings, analyses, and recommendations to a wide range of audiences, including both technical and non-technical stakeholders

Qualifications

REQUIRED EDUCATION AND EXPERIENCE:

Bachelor’s degree in mechanical or aerospace engineering

5+ years’ experience with mechanical modeling and simulation (e.g., FEA/ANSYS, MATLAB, vibration, shock, thermal fatigue)

Experience with or knowledge of systems engineering principles

Interim secret clearance is required to start with the ability to obtain a secret clearance. SAIC will sponsor the clearance process

Must be a US citizen

PREFERRED EXPERIENCE:

Experience with missile system hardware design and analysis

Familiarity with microelectronics packaging and assembly, including solder interconnect technologies

Target salary range: $80,001 - $120,000. The estimate displayed represents the typical salary range for this position based on experience and other factors.